Materials for electronic packaging
by Chung, Deborah D. L.
Publisher: Oxford Butterworth-Heinemann 1995Edition: 1st ed.Description: xiv, 368 p. ill. 24 cm.ISBN: 0750693142.Subject(s): Electronic packaging-MaterialsOnline resources: Click here to access online | Click here to access onlineItem type | Current location | Call number | Copy number | Status | Date due | Barcode |
---|---|---|---|---|---|---|
Edited Book | Central Library, BUET Circulation section | 623.81046/CHU/1995 (Browse shelf) | 1 | Available | 105210 | |
Edited Book | Central Library, BUET Circulation section | 623.81046/CHU/1995 (Browse shelf) | 2 | Available | 105211 |
Browsing Central Library, BUET Shelves , Shelving location: Circulation section Close shelf browser
623.8102/GAD/2006 MEMS handbook | 623.81045/KAS/2009 Optoelectronics and photonics: principles and practices: | 623.81046/CHU/1995 Materials for electronic packaging | 623.81046/CHU/1995 Materials for electronic packaging | 623.81046/MOO/2010 Characterization of integrated circuit packaging materials / | 623.81046/STU/2014 Microwave and millimeter-wave electronic packaging / | 623.8105/PLO/2001 Electronics and communications for scientists and engineers |
Includes bibliographies
There are no comments for this item.