Characterization of integrated circuit packaging materials
by Moore, Thomas M; McKenna, Robert G.
Series: Materials characterization series.Publisher: Boston Butterworth-Heinemann 1993Edition: 1st ed.Description: xviii, 274 p. ill. 24 cm.ISBN: 9781606501870; 1606501879.Subject(s): Electronic packaging| Item type | Current location | Call number | Copy number | Status | Date due | Barcode |
|---|---|---|---|---|---|---|
| Edited Book | Central Library, BUET Reading section | 623.81046/MOO/2010 (Browse shelf) | 1 | Available | 109701 |
Browsing Central Library, BUET Shelves , Shelving location: Reading section Close shelf browser
|
|
|
|
|
No cover image available No cover image available |
|
||
| 623.81045/CHU/1995 Physics of optoelectronic devices | 623.81045/SYM/1993 Semiconductor materials for optoelectronics and LTMBE materials | 623.81045/WIL/1992 Optoelectronics | 623.81046/MOO/2010 Characterization of integrated circuit packaging materials | 623.81078/ANA/2004 Electronic instruments and instrumentation technology | 623.81078/COO/1970 Electronic instrumentation and measurement techniques | 623.81078/GUP/1994 Electronics and instrumentation |
Includes bibliographies
There are no comments for this item.