Characterization of integrated circuit packaging materials /
by Moore, Thomas M; McKenna, Robert G.
Publisher: New York; Momentum Press, 2010Description: xx, 274 p. : ill.ISBN: 9781606501870.Subject(s): Electronic packaging-MaterialsItem type | Current location | Call number | Copy number | Status | Date due | Barcode |
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Edited Book | Central Library, BUET Circulation section | 623.81046/MOO/2010 (Browse shelf) | 1 | Available | 110972 |
Browsing Central Library, BUET Shelves , Shelving location: Circulation section Close shelf browser
623.81045/KAS/2009 Optoelectronics and photonics: principles and practices: | 623.81046/CHU/1995 Materials for electronic packaging | 623.81046/CHU/1995 Materials for electronic packaging | 623.81046/MOO/2010 Characterization of integrated circuit packaging materials / | 623.81046/STU/2014 Microwave and millimeter-wave electronic packaging / | 623.8105/PLO/2001 Electronics and communications for scientists and engineers | 623.81076/CAT/1990 2000 solved problems in electronics |
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