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Predictions of thermal cycling life of PBGA microprocessor components with variation of mechanical properties of the packaging materials

by Shahedi Shakil, Ahmad.
Publisher: Dhaka Department of Mechanical Engineering, BUET 2017Description: xiii, 72p.Subject(s): Materials-Mechanical propertiesOnline resources: Click here to access online
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Item type Current location Call number Copy number Status Date due Barcode
Thesis Central Library, BUET
Reference section 		620.1123/SHA/2017 (Browse shelf) 1 Available 115913

One CD-ROM

Includes bibliographies

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