IEEE electronics packaging technology
by IEEE electronics packaging technology conference 2017 (EPTC 2017) Dhaka; .
Publisher: Dhaka Department of Glass and Ceramic Engineering, BUET 2017Subject(s): Technological forecastingItem type | Current location | Call number | Copy number | Status | Date due | Barcode |
---|---|---|---|---|---|---|
Proceedings | Central Library, BUET Reference section | 600/IEE/2017 (Browse shelf) | 1 | Available | 116146 |
Only CD-ROM
There are no comments for this item.