<![CDATA[ Search for 'au:"Chung, Deborah D. L."']]>

<![CDATA[ Search for 'au:"Chung, Deborah D. L."']]> http://lib.buet.ac.bd/cgi-bin/koha/opac-search.pl?q=ccl=au%3A%22Chung%2C%20Deborah%20D.%20L.%22&format=rss2 2 0 50 Materials for electronic packaging ISBN 0750693142 http://lib.buet.ac.bd/cgi-bin/koha/opac-detail.pl?biblionumber=3007

By Chung, Deborah D. L. . Oxford Butterworth-Heinemann 1995 . xiv, 368 p. 24 cm.. 0750693142

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]]> http://lib.buet.ac.bd/cgi-bin/koha/opac-detail.pl?biblionumber=3007 Composite materials ISBN 185233665X http://lib.buet.ac.bd/cgi-bin/koha/opac-detail.pl?biblionumber=32362

By Chung, Deborah D. L.. London Springer 2003 . xiii, 289 p. .. 185233665X

Place Hold on Composite materials

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