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1. Characterization of integrated circuit packaging materials

by Moore, Thomas M; McKenna, Robert G.

Publisher: New York; Momentum Press, 2010Availability: Items available for loan: Central Library, BUET [623.81046/MOO/2010] (1).

2. Materials for electronic packaging

by Chung, Deborah D. L.

Edition: 1st ed.Publisher: Oxford Butterworth-Heinemann 1995Online Access: Click here to access online | Click here to access online Availability: Items available for loan: Central Library, BUET [623.81046/CHU/1995] (2).

3. Characterization of integrated circuit packaging materials

by Moore, Thomas M; McKenna, Robert G.

Edition: 1st ed.Publisher: Boston Butterworth-Heinemann 1993Availability: Items available for loan: Central Library, BUET [623.81046/MOO/2010] (1).

4. Electronic packaging handbook

by Blackwell, Glenn R.

Edition: 1st ed.Publisher: Boca Raton, FL CRC Press 2000Online Access: Click here to access online Availability: No items available

5. Electronic packaging handbook

by Blackwell, Glenn R.

Edition: 1st ed.Publisher: Boca Raton, FL CRC Press 2000Availability: Items available for loan: Central Library, BUET [623.81046/BLA/2000] (1).

6. Handbook of electronic packaging

by Harper, Charles A.

Edition: 1st ed.Publisher: New York McGraw-Hill 1969Availability: Items available for reference: Central Library, BUET [623.8102/HAR/1969] (2 ).