BUET online Catalog › Results of search for '(su:{Electronic packaging-Materials})'

	1.	Characterization of integrated circuit packaging materials by Moore, Thomas M; McKenna, Robert G. Publisher: New York; Momentum Press, 2010Availability: Items available for loan: Central Library, BUET [623.81046/MOO/2010] (1). Place hold Add to cart (remove)
	2.	Materials for electronic packaging by Chung, Deborah D. L. Edition: 1st ed.Publisher: Oxford Butterworth-Heinemann 1995Online Access: Click here to access online \| Click here to access online Availability: Items available for loan: Central Library, BUET [623.81046/CHU/1995] (2). Place hold Add to cart (remove)

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