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Results of search for '(su:{Packaging })'

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Your search returned 11 results.

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	1.	Characterization of integrated circuit packaging materials by Moore, Thomas M; McKenna, Robert G. Publisher: New York; Momentum Press, 2010Availability: Items available for loan: Central Library, BUET [623.81046/MOO/2010] (1). Place hold Add to cart (remove)
	2.	Microwave and millimeter-wave electronic packaging by Sturdivant, Rick. Edition: Ist ed.Publisher: Boston: Artech House, 2014Availability: Items available for loan: Central Library, BUET [623.81046/STU/2014] (1). Place hold Add to cart (remove)
	3.	Materials for electronic packaging by Chung, Deborah D. L. Edition: 1st ed.Publisher: Oxford Butterworth-Heinemann 1995Online Access: Click here to access online \| Click here to access online Availability: Items available for loan: Central Library, BUET [623.81046/CHU/1995] (2). Place hold Add to cart (remove)
	4.	No cover image available No cover image available Paper and board in packaging; lectures delivered to a summer school organized jointly by the Manchester College of Science and Technology and PATRA, the Printing, Packaging and Allied Trades Research Association, with co-operation from the Institute of Packaging, and held at the Manchester College of Science and Technology in June 1961 by Gordon, G. A; Hine, D. J; Young, J. H. Edition: 1st ed.Publisher: New York Pergamon Press 1963Availability: Items available for loan: Central Library, BUET [658.7884/GOR/1963] (3). Place hold Add to cart (remove)
	5.	No cover image available No cover image available Package design engineering by Brown, Kenneth. Edition: 1st ed. Publisher: New York John Wiley & Sons 1959Availability: Items available for loan: Central Library, BUET [674.82/BRO/1959] (1). Place hold Add to cart (remove)
	6.	Fundamantals of food engineering by Rao, D. G. Edition: 1st ed.Publisher: New Delhi PHI Learning 2010Availability: Items available for loan: Central Library, BUET [664.092/RAO/2010] (1). Place hold Add to cart (remove)
	7.	Characterization of integrated circuit packaging materials by Moore, Thomas M; McKenna, Robert G. Edition: 1st ed.Publisher: Boston Butterworth-Heinemann 1993Availability: Items available for loan: Central Library, BUET [623.81046/MOO/2010] (1). Place hold Add to cart (remove)
	8.	Electronic packaging handbook by Blackwell, Glenn R. Edition: 1st ed.Publisher: Boca Raton, FL CRC Press 2000Online Access: Click here to access online Availability: No items available Add to cart (remove)
	9.	Electronic packaging handbook by Blackwell, Glenn R. Edition: 1st ed.Publisher: Boca Raton, FL CRC Press 2000Availability: Items available for loan: Central Library, BUET [623.81046/BLA/2000] (1). Place hold Add to cart (remove)
	10.	No cover image available No cover image available Handbook of electronic packaging by Harper, Charles A. Edition: 1st ed.Publisher: New York McGraw-Hill 1969Availability: Items available for reference: Central Library, BUET [623.8102/HAR/1969] (2 ). Place hold Add to cart (remove)
	11.	Current technologies in flexible packaging by Troedel, Michael L. -- Symposium on current technologies in flexible packaging St. Charles 1/11/1984; . Publisher: Philadelphia ASTM 1986Availability: Items available for loan: Central Library, BUET [688.8/SYM/1986] (1). Place hold Add to cart (remove)