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Microvias For Low Cost, High Density Interconnects

by Lau, John H; Lee, Ricky S. W.
Publisher: New York : McGraw-Hill Professional Publishing 2001Description: 565 p. ill.ISBN: 9780071363273; 0071363270 (Trade Cloth).Subject(s): Microvias, Low, Cost, High, Density, InterconnectsOnline resources: Full text available from AccessEngineering
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Item type Current location Call number Copy number Status Date due Barcode
General Book Central Library, BUET
Reading section 		623.817/LAU/2001 (Browse shelf) 1 Available 99474

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