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1.
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Characterization of integrated circuit packaging materials
by Moore, Thomas M;
McKenna, Robert G.
Publisher: New York; Momentum Press, 2010Availability: Items available for loan: Central Library, BUET [623.81046/MOO/2010] (1).
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2.
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Microwave and millimeter-wave electronic packaging
by Sturdivant, Rick.
Edition: Ist ed.Publisher: Boston: Artech House, 2014Availability: Items available for loan: Central Library, BUET [623.81046/STU/2014] (1).
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3.
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Materials for electronic packaging
by Chung, Deborah D. L.
Edition: 1st ed.Publisher: Oxford Butterworth-Heinemann 1995Online Access: Click here to access online | Click here to access online Availability: Items available for loan: Central Library, BUET [623.81046/CHU/1995] (2).
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4.
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Paper and board in packaging; lectures delivered to a summer school organized jointly by the Manchester College of Science and Technology and PATRA, the Printing, Packaging and Allied Trades Research Association, with co-operation from the Institute of Packaging, and held at the Manchester College of Science and Technology in June 1961
by Gordon, G. A;
Hine, D. J;
Young, J. H.
Edition: 1st ed.Publisher: New York Pergamon Press 1963Availability: Items available for loan: Central Library, BUET [658.7884/GOR/1963] (3).
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5.
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Package design engineering
by Brown, Kenneth.
Edition: 1st ed. Publisher: New York John Wiley & Sons 1959Availability: Items available for loan: Central Library, BUET [674.82/BRO/1959] (1).
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6.
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Fundamantals of food engineering
by Rao, D. G.
Edition: 1st ed.Publisher: New Delhi PHI Learning 2010Availability: Items available for loan: Central Library, BUET [664.092/RAO/2010] (1).
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7.
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Characterization of integrated circuit packaging materials
by Moore, Thomas M;
McKenna, Robert G.
Edition: 1st ed.Publisher: Boston Butterworth-Heinemann 1993Availability: Items available for loan: Central Library, BUET [623.81046/MOO/2010] (1).
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8.
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Electronic packaging handbook
by Blackwell, Glenn R.
Edition: 1st ed.Publisher: Boca Raton, FL CRC Press 2000Online Access: Click here to access online Availability: No items available
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9.
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Electronic packaging handbook
by Blackwell, Glenn R.
Edition: 1st ed.Publisher: Boca Raton, FL CRC Press 2000Availability: Items available for loan: Central Library, BUET [623.81046/BLA/2000] (1).
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10.
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Handbook of electronic packaging
by Harper, Charles A.
Edition: 1st ed.Publisher: New York McGraw-Hill 1969Availability: Items available for reference: Central Library, BUET [623.8102/HAR/1969] (2 ).
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11.
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Current technologies in flexible packaging
by Troedel, Michael L.
-- Symposium on current technologies in flexible packaging St. Charles 1/11/1984;
.
Publisher: Philadelphia ASTM 1986Availability: Items available for loan: Central Library, BUET [688.8/SYM/1986] (1).
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