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1. Characterization of integrated circuit packaging materials

by Moore, Thomas M; McKenna, Robert G.

Publisher: New York; Momentum Press, 2010Availability: Items available for loan: Central Library, BUET [623.81046/MOO/2010] (1).

2. Characterization of integrated circuit packaging materials

by Moore, Thomas M; McKenna, Robert G.

Edition: 1st ed.Publisher: Boston Butterworth-Heinemann 1993Availability: Items available for loan: Central Library, BUET [623.81046/MOO/2010] (1).