| 000 | 00575nam a22001931 4500 | ||
|---|---|---|---|
| 001 | 23644 | ||
| 003 | BD-DhUET | ||
| 008 | 740518s1968 nyua b 000 0 eng | ||
| 040 |
_aDLC _cDLC _dBD-DhUET |
||
| 082 | 0 | 0 |
_a623.815 _bSID/1968 |
| 100 | _aSideris, George | ||
| 245 | 1 | 0 |
_aMicroelectronic packaging _c[edited by] George Sideris. _binterconnection and assembly of integrated circuits |
| 250 | _a1st ed. | ||
| 260 |
_aNew York _bMcGraw-Hill _c1968 |
||
| 300 |
_ax, 299 p. _billus. _c26 cm. |
||
| 504 | _aIncludes bibliographies | ||
| 650 | 0 | _aMicroelectronics | |
| 942 | _cEB | ||
| 999 |
_c23644 _d23644 |
||