| 000 | 00703nam a22002052 b4500 | ||
|---|---|---|---|
| 003 | BD-DhUET | ||
| 008 | 000614e20010426nyua s|||||||| 2|eng|d | ||
| 020 | _a9780071363273 | ||
| 020 | _a0071363270 (Trade Cloth) | ||
| 040 |
_aBIP US _dBD-DhUET _c0 |
||
| 082 | 0 | 0 |
_a623.817 _bLAU/2001 |
| 100 | 1 | _aLau, John H. | |
| 245 | 1 | 0 |
_aMicrovias _bFor Low Cost, High Density Interconnects |
| 260 |
_aNew York : _bMcGraw-Hill Professional Publishing _c2001 |
||
| 300 |
_a565 p. _bill. |
||
| 650 | 0 | _aMicrovias, Low, Cost, High, Density, Interconnects | |
| 700 | 1 | _aLee, Ricky S. W. | |
| 856 | 4 | 0 |
_uhttp://www.columbia.edu/cgi-bin/cul/resolve?clio10643507 _zFull text available from AccessEngineering |
| 942 | _cGB | ||
| 999 |
_c30674 _d30674 |
||