| 000 | 00632nam a2200205 a 4500 | ||
|---|---|---|---|
| 001 | 341 | ||
| 003 | BD-DhUET | ||
| 008 | 930317s1993 maua b 001 0 eng | ||
| 020 | _a9781606501870 | ||
| 040 |
_aDLC _c0 _dBD-DhUET |
||
| 082 | 0 | 0 |
_a623.81046 _bMOO/2010. |
| 245 | 0 | 0 |
_aCharacterization of integrated circuit packaging materials / _cedited by Thomas M. Moore and Robert G. McKenna. |
| 260 |
_aNew York; _bMomentum Press, _c2010. |
||
| 300 |
_axx, 274 p. : _bill. ; |
||
| 504 | _aIncludes bibliographies | ||
| 650 | 0 | _aElectronic packaging-Materials | |
| 700 | 1 | _aMoore, Thomas M. | |
| 700 | 1 | _aMcKenna, Robert G. | |
| 942 | _cEB | ||
| 999 |
_c341 _d341 |
||