000			00705nam a2200217 4500
001			42014
003			BD-DhUET
008			190911b xxu||||| |||| 00| 0 eng d
040			_c0 _dBD-DhUET
082			_a620.1123 _bTUS/2019
100			_aTusher Ahmed, Md.
245			_aEffect of thermal aging on electromigration failure of a flip-chip SnAgCu solder joint
260			_aDhaka _bDepartment of Mechanical Engineering _c2019
300			_axvi, 114 p.
501			_aOne CD-ROM
504			_aIncludes bibliographies
650		0	_aMaterials-Mechanical properties
720			_aDr. Mohammad Abdul Motalab _eM.Sc. Thesis
856			_uhttp://lib.buet.ac.bd:8080/xmlui/handle/123456789/5421
942			_cTH
999			_c42014 _d42014