Cross-talk analysis of spoof surface plasmon polariton interconnects for ultrafast chip-to-chip communication

Abstract

In this work, we demonstrated that spoof plasmon, a special mode in surface plasmon can be artfully employed to design an interconnect system with tunable transmission and cross-talk coefficient within adjacent wires. We have reported that the transmission and cross-talk characteristics of such an Spoof Surface Plasmon Polariton (SSPP) system can be tuned by changing the groove’s height and width or the length of the interconnect. Moreover, the behavior of SSPP wires while routing in the curved pathways, i.e., 0◦ (straight), 45◦, 90◦ pathways and also the routing of SSPP interconnects in S-shape curvature is elaborately discussed in this work. However, by introducing a geometrical mismatch in the groove’s height and width of the channel, we have shown a remarkable suppression of coupling co-efficient within adjacent wires in a pair of SSPP interconnect. While the conventional technique of minimizing cross-talk almost invariably relies on increased spacing within the adjacent wires, we recognize that such an approach would not suit highly integrated electronics. The high density of components puts a premium on available space. However, our strategy counts on a radically different mechanism to reduce cross-talk to a minimal value near the channel’s operating bandwidth. In this study, adjacent SSPP interconnects are placed in such a way, called face-to-face placement of SSPP wires, that ensures maximum mutual coupling within wires in the system, at the same time, the EM waves are highly self-coupled to the metal-dielectric interface itself, resulting in periodic fluctuations in the crosstalk coefficient. A periodic change in the crosstalk results in a discrete number of bandwidths with crosstalk minima present in the middle of each band. Notably, conventional interconnect technologies cannot assimilate our proposed cross-talk minimization technique, as it exclusively relies on the ’Wilberforce Pendulum’ principle of paired spoof plasmon interconnects.