Tusher Ahmed, Md.
Effect of thermal aging on electromigration failure of a flip-chip SnAgCu solder joint - Dhaka Department of Mechanical Engineering 2019 - xvi, 114 p.
One CD-ROM
Includes bibliographies
Materials-Mechanical properties
620.1123 / TUS/2019
Effect of thermal aging on electromigration failure of a flip-chip SnAgCu solder joint - Dhaka Department of Mechanical Engineering 2019 - xvi, 114 p.
One CD-ROM
Includes bibliographies
Materials-Mechanical properties
620.1123 / TUS/2019