| 000 -LEADER |
|---|
| fixed length control field |
00705nam a2200217 4500 |
| 001 - CONTROL NUMBER |
|---|
| control field |
42014 |
| 003 - CONTROL NUMBER IDENTIFIER |
|---|
| control field |
BD-DhUET |
| 008 - FIXED-LENGTH DATA ELEMENTS--GENERAL INFORMATION |
|---|
| fixed length control field |
190911b xxu||||| |||| 00| 0 eng d |
| 040 ## - CATALOGING SOURCE |
|---|
| Transcribing agency |
0 |
| Modifying agency |
BD-DhUET |
| 082 ## - DEWEY DECIMAL CLASSIFICATION NUMBER |
|---|
| Classification number |
620.1123 |
| Item number |
TUS/2019 |
| 100 ## - MAIN ENTRY--PERSONAL NAME |
|---|
| Personal name |
Tusher Ahmed, Md. |
| 245 ## - TITLE STATEMENT |
|---|
| Title |
Effect of thermal aging on electromigration failure of a flip-chip SnAgCu solder joint |
| 260 ## - PUBLICATION, DISTRIBUTION, ETC. (IMPRINT) |
|---|
| Place of publication, distribution, etc. |
Dhaka |
| Name of publisher, distributor, etc. |
Department of Mechanical Engineering |
| Date of publication, distribution, etc. |
2019 |
| 300 ## - PHYSICAL DESCRIPTION |
|---|
| Extent |
xvi, 114 p. |
| 501 ## - WITH NOTE |
|---|
| With note |
One CD-ROM |
| 504 ## - BIBLIOGRAPHY, ETC. NOTE |
|---|
| Bibliography, etc |
Includes bibliographies |
| 650 #0 - SUBJECT ADDED ENTRY--TOPICAL TERM |
|---|
| Topical term or geographic name as entry element |
Materials-Mechanical properties |
| 720 ## - ADDED ENTRY--UNCONTROLLED NAME |
|---|
| Thesis Supervisor |
Dr. Mohammad Abdul Motalab |
| Relator term |
M.Sc. Thesis |
| 856 ## - ELECTRONIC LOCATION AND ACCESS |
|---|
| Uniform Resource Identifier |
http://lib.buet.ac.bd:8080/xmlui/handle/123456789/5421 |
| 942 ## - ADDED ENTRY ELEMENTS (KOHA) |
|---|
| Koha item type |
Thesis |