Koha online

Your cart is empty.

Your search returned 6 results. Subscribe to this search

Unhighlight Highlight
|
1.
No cover image available No cover image available
Stress analysis of a sandwich structure having isotropic layers using finite difference method

by Khairul Habib Pulok, Md.

Publisher: Dhaka Department of Mechanical Engineering, BUET 2016Online Access: Click here to access online Availability: Items available for loan: Central Library, BUET [620.1123/KHA/2016] (1).

Place hold Add to cart
2.
No cover image available No cover image available
Predictions of thermal cycling life of PBGA microprocessor components with variation of mechanical properties of the packaging materials

by Shahedi Shakil, Ahmad.

Publisher: Dhaka Department of Mechanical Engineering, BUET 2017Online Access: Click here to access online Availability: Items available for loan: Central Library, BUET [620.1123/SHA/2017] (1).

Place hold Add to cart
3.
No cover image available No cover image available
Effect of thermal aging on electromigration failure of a flip-chip SnAgCu solder joint

by Tusher Ahmed, Md.

Publisher: Dhaka Department of Mechanical Engineering 2019Online Access: Click here to access online Availability: Items available for loan: Central Library, BUET [620.1123/TUS/2019] (1).

Place hold Add to cart
4.
No cover image available No cover image available
Effects of thermal aging on plastic ball grid array microprocessor life under power and mechanical cycling

by Kamruzzaman, Md.

Publisher: Dhaka Department of Mechanical Engineering, BUET 2019Online Access: Click here to access online Availability: Items available for loan: Central Library, BUET [620.1123 /KAM/2019] (1).

Place hold Add to cart
5.
No cover image available No cover image available
Effects of minor Ti and Zr addition on the microstructure and mechanical properties of Al-Mg based alloy

by Sanjidah Akter Urmi.

Publisher: Dhaka Department of Materials and Metallurgical Engineering, BUET 2019Online Access: Click here to access online Availability: Items available for loan: Central Library, BUET [620.1123/SAN/2019] (1).

Place hold Add to cart
6.
No cover image available No cover image available
Mechanical behavior of solder affected copper-bulk subjected to work-hardening and thermal treatment

by Muzibur Rahman, M.

Publisher: Dhaka Department of Mechanical Engineering, BUET 2021Online Access: Click here to access online Availability: Items available for loan: Central Library, BUET [620.1123/MUZ/2021] (1).

Place hold Add to cart