Effect of thermal aging on electromigration failure of a flip-chip SnAgCu solder joint
by Tusher Ahmed, Md.
Publisher: Dhaka Department of Mechanical Engineering 2019Description: xvi, 114 p.Subject(s): Materials-Mechanical propertiesOnline resources: Click here to access onlineItem type | Current location | Call number | Copy number | Status | Date due | Barcode |
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Thesis | Central Library, BUET Reference section | 620.1123/TUS/2019 (Browse shelf) | 1 | Available | 117214 |
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620.1123/SYM/1990 Charpy impact test | 620.1123/SYM/1995 Pendulum impact machines | 620.1123/SYM/1995 Pendulum impact machines | 620.1123/TUS/2019 Effect of thermal aging on electromigration failure of a flip-chip SnAgCu solder joint | 620.1126/BAR/2013 Development of rod penetration test to measure shear strength of cohesive soil | 620.1126/INT/1988 Nonlinear fracture mechanics | 620.1126/INT/1994 Automation in fatigue and fracture |
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