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Effect of thermal aging on electromigration failure of a flip-chip SnAgCu solder joint

by Tusher Ahmed, Md.
Publisher: Dhaka Department of Mechanical Engineering 2019Description: xvi, 114 p.Subject(s): Materials-Mechanical propertiesOnline resources: Click here to access online
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Item type Current location Call number Copy number Status Date due Barcode
Thesis Central Library, BUET
Reference section 		620.1123/TUS/2019 (Browse shelf) 1 Available 117214

One CD-ROM

Includes bibliographies

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